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version 1.0 jan. 2004 md16r1624(8/g)eg0 change history version 1.0 (january 2004) * first copy. * based on version 1.0 (july 2002) 256mbit d-die 32 bit rimm ? module datasheet
page 1 version 1.0 jan. 2004 md16r1624(8/g)eg0 overview the 32 bit rimm ? module is a general purpose high-perfor- mance line of memory modules suitable for use in a broad range of applications includi ng computer memory, personal computers, workstations, and other applications where high bandwidth and low latency are required. the 32 bit rimm module consists of 256mb rdram ? devices. these are extremely high-speed cmos drams organized as 16m words by 16 bits. the use of rambus signaling level (rsl) technology permits the use of conventional system and board design technologies. the 32 bit rimm module supports transfer rate per pin from 800 to 1200mhz, resulting in respec tive total module band width from 3200mb/s or 3.2gb/s for rimm 3200 modules to 4800mb/s or 4.8gb/s for rimm 4800 modules. the 32 bit rimm module provi des two independent 16 bit memory channels to facilitate compact system design. the "thru" channel enters and exits the module to support a connection to or from a controller, memory slot, or termina- tion. the "term" channel is terminated on the module and supports a connection from a c ontroller or another memory slot. the rdram architecture enables the highest sustained bandwidth for multiple, simu ltaneous, randomly addressed memory transactions. the sepa rate control and data buses with independent row and column control yield over 95% bus efficiency. the rdram device multi-bank architecture supports up to four simultaneous transactions per device. features ? 2 independent rdram channels, 1 pass through and 1 terminated on 32 bit rimm module ? high speed 800, 1066 and 1200mhz rdram devices ? 232 edge connector pads with 1mm pad spacing ? module pcb size: 133.35mm x 34.93mm x 1.27mm (5.25? x 1.375? x 0.05?) ? each rdram device has 32 banks, for a total of 512, 256, 128 banks on each 512mb, 256mb, 128mb module respectively ? gold plated edge connector pad contacts ? serial presence de tect (spd) support ? operates from a 2.5 volt supply (5%) ? low power and powerdown self refresh modes ? separate row and column buses for higher efficiency ? wbga lead free package (84 balls) key timing parameters the following table lists th e frequency and latency bins available for 32 bit rimm modules. form factor the 32 bit rimm modules are offered in 232-pad 1mm edge connector pad pitch suitable for 232 contact rimm connec- tors. figure 1 below, shows a sixteen device 32 bit rimm module. table 1: 32 bit rimm module frequency and latency organiza- tion speed part number i/o freq. (mhz) t rac (row access time) ns rimm 4800 32m x 32 1200mhz 32 md16r1624eg0-cn1 64m x 32 md16r1628eg0-cn1 128m x 32 md16r162geg0-cn1 rimm 4200 32m x 32 1066mhz 32p md16r1624eg0-ct9 64m x 32 md16r1628eg0-ct9 128m x 32 md16r162geg0-ct9 rimm 3200 32m x 32 800mhz 40 MD16R1624EG0-CM8 64m x 32 md16r1628eg0-cm8 128m x 32 md16r162geg0-cm8 (16mx16)*4(8/16)pcs 32 bit rimm ? module based on 256mb e-die, 32s banks,16k/32ms ref, 2.5v figure 1 : 32 bit rimm module with heat spreader removed note: on double sided modules, rdram devices are also installed on bottom side of pcb.
page 2 version 1.0 jan. 2004 md16r1624(8/g)eg0 table 2: module pad numbers and signal names pin pin name pin pin name pin pin name pin pin name a1 gnd b1 gnd a59 gnd b59 gnd a2 sck_thru_l b2 cmd_thru_l a60 vterm b60 vterm a3 gnd b3 gnd a61 vterm b61 vterm a4 dqa8_thru_l b4 dqa7_thru_l a62 gnd b62 gnd a5 gnd b5 gnd a63 dqa3_thru_r b63 dqa4_thru_r a6 dqa6_thru_l b6 dqa5_thru_l a64 gnd b64 gnd a7 gnd b7 gnd a65 dqa5_thru_r b65 dqa6_thru_r a8 dqa4_thru_l b8 dqa3_thru_l a66 gnd b66 gnd a9 gnd b9 gnd a67 dqa7_thru_r b67 dqa8_thru_r a10 dqa2_thru_l b10 dqa1_thru_l a68 gnd b68 gnd a11 gnd b11 gnd a69 vdd b69 vdd a12 dqa0_thru_l b12 ctm n_thru_l a70 gnd b70 gnd a13 gnd b13 gnd a71 sck_thru_r b71 ctmn_term_l a14 cfm_thru_l b14 ctm_thru_l a72 gnd b72 gnd a15 gnd b15 gnd a73 cmd_t hru_r b73 ctm_term_l a16 cfmn_thru_l b16 row 2_thru_l a74 gnd b74 gnd a17 gnd b17 gnd a75 vref b75 vcmos a18 row1_thru_l b18 row 0_thru_l a76 vdd b76 vdd a19 gnd b19 gnd a77 svdd b77 swp a20 col4_thru_l b20 col 3_thru_l a78 vdd b78 vdd a21 gnd b21 gnd a79 scl b79 sda a22 col2_thru_l b22 col 1_thru_l a80 vdd b80 vdd a23 gnd b23 gnd a81 sa0 b81 sa1 a24 col0_thru_l b24 dqb0_thru_l a82 vdd b82 vdd a25 gnd b25 gnd a83 sa2 b83 sin_term a26 dqb1_thru_l b26 dqb 2_thru_l a84 gnd b84 gnd a27 gnd b27 gnd a85 dqb8_term b85 dqb7_term a28 dqb3_thru_l b28 dqb 4_thru_l a86 gnd b86 gnd a29 gnd b29 gnd a87 dqb6_term b87 dqb5_term a30 dqb5_thru_l b30 dqb 6_thru_l a88 gnd b88 gnd a31 gnd b31 gnd a89 dqb4_term b89 dqb3_term a32 dqb7_thru_l b32 dqb 8_thru_l a90 gnd b90 gnd a33 gnd b33 gnd a91 dqb2_term b91 dqb1_term a34 sout_thru b34 sin_thru a92 gnd b92 gnd a35 gnd b35 gnd a93 dqb0_term b93 col0_term a36 dqb8_thru_r b36 dqb 7_thru_r a94 gnd b94 gnd a37 gnd b37 gnd a95 col1_term b95 col2_term a38 dqb6_thru_r b38 dqb 5_thru_r a96 gnd b96 gnd a39 gnd b39 gnd a97 col3_term b97 col4_term a40 dqb4_thru_r b40 dqb 3_thru_r a98 gnd b98 gnd a41 gnd b41 gnd a99 row0_term b99 row1_term a42 dqb2_thru_r b42 dqb1_thru_r a100 gnd b100 gnd a43 gnd b43 gnd a101 row2 _term b101 cfmn_term a44 dqb0_thru_r b44 col0_thru_r a102 gnd b102 gnd a45 gnd b45 gnd a103 ctm_ term_r b103 cfm_term a46 col1_thru_r b46 col2_thru_r a104 gnd b104 gnd
page 3 version 1.0 jan. 2004 md16r1624(8/g)eg0 a47 gnd b47 gnd a105 ctmn_term_r b105 dqa0_term a48 col3_thru_r b48 col4_thru_r a106 gnd b106 gnd a49 gnd b49 gnd a107 dqa1_term b107 dqa2_term a50 row0_thru_r b50 row1_thru_r a108 gnd b108 gnd a51 gnd b51 gnd a109 dqa3_term b109 dqa4_term a52 row2_thru_r b52 cfmn_thru_r a110 gnd b110 gnd a53 gnd b53 gnd a111 dqa5_term b111 dqa6_term a54 ctm_thru_r b54 cfm_thru_r a112 gnd b112 gnd a55 gnd b55 gnd a113 dqa7_term b113 dqa8_term a56 ctmn_thru_r b56 dqa0_thru_r a114 gnd b114 gnd a57 gnd b57 gnd a115 cmd _term b115 sck_term a58 dqa1_thru_r b58 dqa2_thru_r a116 gnd b116 gnd table 2: module pad numbers and signal names (continued) pin pin name pin pin name pin pin name pin pin name table 3: module connector pad description signal module connector pads i/o type description cfm_thru_l a14 irsl clock from master. connects to left rdram device on "thru" channel. interface clock used fo r receiving rsl signals from the controller. positive polarity. cfm_thru_r b54 irsl clock from master. connects to right rdram device on "thru" channel. interface clock used fo r receiving rsl signals from the controller. positive polarity. cfmn_thru_l a16 irsl clock from master. connects to left rdram device on "thru" channel. interface clock used fo r receiving rsl signals from the controller. negative polarity. cfmn_thru_r b52 irsl clock from master. connects to right rdram device on "thru" channel. interface clock used fo r receiving rsl signals from the controller. negative polarity. cmd_thru_l b2 iv cmos serial command input used to read from and write to the control registers. also used for power management. connects to left rdram device on "thru" channel. cmd_thru_r a73 iv cmos serial command input used to read from and write to the control registers. also used for power management. connects to right rdram device on "thru" channel. col4_thru_l..c ol0_thru_l a20, b20, a22, b22, a24 irsl "thru" channel column bus. 5-bit bus containing control and address information for column a ccesses. connects to left rdram device on "thru" channel. col4_thru_r..c ol0_thru_r b48, a48, b46, a46, b44 irsl "thru" channel column bus. 5-bit bus containing control and address information for column accesses. connects to right rdram device on "thru" channel. ctm_thru_l b14 irsl clock to master. connects to left rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. positive polarity.
page 4 version 1.0 jan. 2004 md16r1624(8/g)eg0 ctm_thru_r a54 irsl clock to master. connects to right rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctmn_thru_l b12 irsl clock to master. connects to left rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. ctmn_thru_r a56 irsl clock to master. connects to right rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. dqa8_thru_l.. dqa0_thru_l a4, b4, a6, b6, a8, b8, a10, b10, a12 i/o rsl "thru" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to left rdram device on "thru" channel. dqa8_thru_l is non-functional on modules with x16 rdram devices. dqa8_thru_r.. dqa0_thru_r b67, a67, b65, a65, b63, a63, b58, a58, b56 i/o rsl "thru" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to right rdram device on "thru" channel. dqa8_thru_r is non-functional on modules with x16 rdram devices. dqb8_thru_l.. dqb0_thru_l b32, a32, b30, a30, b28, a28, b26, a26, b24 i/o rsl "thru" channel data bus b. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to left rdram device on "thru" channel. dqb8_thru_l is non-functional on modules with x16 rdram devices. dqb8_thru_r.. dqb0_thru_r a36, b36, a38, b38, a40, b40, a42, b42, a44 i/o rsl "thru" channel data bus b. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to right rdram device on "thru" channel. dqb8_thru_r is non-functional on modules with x16 rdram devices. row2_thru_l.. row0_thru_l b16, a18, b18 irsl row bus. 3-bit bus containing control and address information for row accesses. connects to left rdram device on "thru" channel. row2_thru_r.. row0_thru_r a52, b50, a50 irsl row bus. 3-bit bus containing control and address information for row accesses. connects to right rdram device on "thru" chan- nel. sck_thru_l a2 iv cmos serial clock input. clock source used to read from and write to "thru" channel rdram control re gisters. connects to left rdram device on "thru" channel. sck_thru_r a71 iv cmos serial clock input. clock source used to read from and write to "thru" channel rdram control registers. connects to right rdram device on "thru" channel. sin_thru b34 i/o v cmos "thru" channel serial i/o for re ading from and writing to the con- trol registers. attaches to sio0 of right rdram device on "thru" channel. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 5 version 1.0 jan. 2004 md16r1624(8/g)eg0 sout_thru a34 i/o v cmos "thru" channel serial i/o for re ading from and writing to the con- trol registers. attaches to sio1 of left rdram device on "thru" channel. cfm_term b103 irsl clock from master. connects to right rdram device on "term" channel. interface clock used fo r receiving rsl signals from the controller. positive polarity. cfmn_term b101 irsl clock from master. connects to right rdram device on "term" channel. interface clock used fo r receiving rsl signals from the controller. negative polarity. cmd_term a115 iv cmos serial command input used to read from and write to the control registers. also used for power management. connects to right rdram device on "term" channel. col4_term.. col0_term b97, a97, b95, a95, b93 irsl "term" channel column bus. 5- bit bus containing control and address information for column accesses. connects to right rdram device on "term" channel. ctm_term_l b73 irsl clock to master. connects to left rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctm_term_r a103 irsl clock to master. connects to right rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctmn_term_l b71 irsl clock to master. connects to left rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. ctmn_term_r a105 irsl clock to master. connects to right rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. dqa8_term.. dqa0_term b113, a113, b111, a111, b109, a109, b107, a107, b105 i/o rsl "term" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?term? channel. connects to right rdram device on "term" channel. dqa8_term is non-functional on modules with x16 rdram devices. dqb8_term.. dqb0_term a85, b85, a87, b87, a89, b89, a91, b91, a93 i/o rsl "term" channel data bus b. a 9-bi t bus carrying a byte of read or write data between the controller and rdram devices on ?term? channel. connects to right rdram device on "term" channel. dqb8_term is non-functional on modules with x16 rdram devices. row2_term.. row0_term a101, b99, a99 irsl "term" channel row bus. 3-bit bus containing control and address information for row acces ses. connects to ri ght rdram device on "term" channel. sck_term b115 iv cmos serial clock input. clock source used to read from and write to "term" channel rdram control registers. connects to right rdram device on "term" channel. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 6 version 1.0 jan. 2004 md16r1624(8/g)eg0 sin_term b83 i/o v cmos "term" channel serial i/o for re ading from and writing to the con- trol registers. attaches to sio0 of left rdram device on "term" channel. v term a60, b60, a61, b61 "term" channel termination voltage. gnd a1, a3, a5, a7, a9, a11, a13, a15, a17, a19, a21, a23, a25, a27, a29, a31, a33, a35, a37, a39, a41, a43, a45, a47, a49, a51, a53, a55, a57, a59, a62, a64, a66, a68, a70, a72, a74, a84, a86, a88, a90, a92, a94, a96, a98, a100, a102, a104, a106, a108, a110, a112, a114, a116, b1, b3, b5, b7, b9, b11, b13, b15, b17, b19, b21, b23, b25, b27, b29, b31, b33, b35, b37, b39, b41, b43, b45, b47, b49, b51, b53, b55, b57, b59, b62, b64, b66, b68, b70, b72, b74, b84, b86, b88, b90, b92, b94, b96, b98, b100, b102, b104, b106, b108, b110, b112, b114, b116 ground reference for rd ram core and interface. sa0 a81 isv dd serial presence detect address 0. sa1 b81 isv dd serial presence detect address 1. sa2 a83 isv dd serial presence detect address 2. scl a79 isv dd serial presence detect clock. sda b79 i/o sv dd serial presence detect data (open collector i/o). sv dd a77 spd voltage. used for signals scl, sda, swe, sa0, sa1 and sa2. swp b77 isv dd serial presence detect write prot ect (active high). when low, the spd can be written as well as read. v cmos b75 cmos i/o voltage. used for signals cmd, sck, sin, sout. vdd a69, b69, a76, b76, a78, b78, a80, b80, a82, b82 supply voltage fo r the rdram core and interface logic. vref a75 logic threshold reference voltage for both "thru" channel and "term" channel rsl signals. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 7 version 1.0 jan. 2004 md16r1624(8/g)eg0 figure 1: 32 bit rimm module functional diagram dqa8 dqa7 dqa6 dqa5 dqa4 dqa3 dqa2 dqa1 dqa0 cfm cfmn ctm ctmn row2 row1 row0 col4 col3 col2 col1 col0 dqb0 dqb1 dqb2 dqb3 dqb4 dqb5 dqb6 dqb7 dqb8 sio0 sio1 sck cmd vref (256mb) dqa8_thru_r dqa7_thru_r dqa6_thru_r dqa5_thru_r dqa4_thru_r dqa3_thru_r dqa2_thru_r dqa1_thru_r dqa0_thru_r cfm_thru_r cfmn_thru_r ctm_thru_r ctmn_thru_r row2_thru_r row1_thru_r row0_thru_r col4_thru_r col3_thru_r col2_thru_r col1_thru_r col0_thru_r dqb0_thru_r dqb1_thru_r dqb2_thru_r dqb3_thru_r dqb4_thru_r dqb5_thru_r dqb6_thru_r dqb7_thru_r dqb8_thru_r dqa8_thru_l dqa7_thru_l dqa6_thru_l dqa5_thru_l dqa4_thru_l dqa3_thru_l dqa2_thru_l dqa1_thru_l dqa0_thru_l cfm_thru_l cfmn_thru_l ctm_thru_l ctmn_thru_l row2_thru_l row1_thru_l row0_thru_l col4_thru_l col3_thru_l col2_thru_l col1_thru_l col0_thru_l dqb0_thru_l dqb1_thru_l dqb2_thru_l dqb3_thru_l dqb4_thru_l dqb5_thru_l dqb6_thru_l dqb7_thru_l dqb8_thru_l left rdram device of "thru" channel sout_thru sck_thru_r cmd_thru_l v ref sin_thru vdd gnd 2 per rdram device scl sda a0 a1 scl sa0 sa1 serial presence detect dqa8 dqa7 dqa6 dqa5 dqa4 dqa3 dqa2 dqa1 dqa0 cfm cfmn ctm ctmn row2 row1 row0 col4 col3 col2 col1 col0 dqb0 dqb1 dqb2 dqb3 dqb4 dqb5 dqb6 dqb7 dqb8 sio0 sio1 sck cmd vref (256mb) v ref gnd 1 per 2 rdram devices v cmos gnd 1 per 2 rdram devices a2 sa2 swp swp u0 vcc sv dd 0.22 f 0.22 f 0.22 f sv dd gnd 0.22 f . . . plus one near connector right rdram device of "thru" channel dqa8 dqa7 dqa6 dqa5 dqa4 dqa3 dqa2 dqa1 dqa0 cfm cfmn ctm ctmn row2 row1 row0 col4 col3 col2 col1 col0 dqb0 dqb1 dqb2 dqb3 dqb4 dqb5 dqb6 dqb7 dqb8 sio0 sio1 sck cmd vref (256mb) dqa8_term dqa7_term dqa6_term dqa5_term dqa4_term dqa3_term dqa2_term dqa1_term dqa0_term cfm_term cfmn_term ctm_term_r ctmn_term_r row2_term row1_term row0_term col4_term col3_term col2_term col1_term col0_term dqb0_term dqb1_term dqb2_term dqb3_term dqb4_term dqb5_term dqb6_term dqb7_term dqb8_term ctm_term_l ctmn_term_l left rdram device of "term" channel sin_term sck_term cmd_term dqa8 dqa7 dqa6 dqa5 dqa4 dqa3 dqa2 dqa1 dqa0 cfm cfmn ctm ctmn row2 row1 row0 col4 col3 col2 col1 col0 dqb0 dqb1 dqb2 dqb3 dqb4 dqb5 dqb6 dqb7 dqb8 sio0 sio1 sck cmd vref (256mb) . . . right rdram device of "term" channel sda v term gnd 1 per 2 termination resistors v term cmd_thru_r sck_thru_l 28 ? 39 ? 91 ? 10k ? 28 ? 39 ? 91 ? module capacity n 512mb 16 256mb 8 128mb 4 47kohm
page 8 version 1.0 jan. 2004 md16r1624(8/g)eg0 absolute maximum ratings dc recommended electrical conditions 32 bit rimm module capacity and number of rdram device table 4 : absolute maximum ratings symbol parameter min max unit v i,abs voltage applied to any rsl or cmos signal pad with respect to gnd - 0.3 v dd + 0.3 v v dd,abs voltage on vdd with respect to gnd - 0.5 v dd + 1.0 v t store storage temperature - 50 100 c t plate plate temperature - 92 c table 5 : dc recommended electrical conditions symbol parameter and conditions min max unit v dd supply voltage a a. see direct rdram tm datasheet for more details 2.50 - 0.13 2.50 + 0.13 v v cmos cmos i/o power supply at pad for 2.5v controllers cmos i/o power supply at pad for 1.8v controllers vdd 1.8 - 0.1 vdd 1.8 + 0.2 v v v ref reference voltage a 1.4 - 0.2 1.4 + 0.2 v svdd serial presence detect or- positive power supply 2.2 3.6 v v term termination voltage 1.8 - 0.09 1.8 + 0.09 v v term v ref nominal rsl signal half swing -0.46v table 6: 32 bit rimm module capaci ty and number of rdram device 512mb 256mb 128mb unit number of 256mb rdram devices 16 8 4 pcs channel 1 channel 2 8 8 4 4 2 2
page 9 version 1.0 jan. 2004 md16r1624(8/g)eg0 32 bit rimm module current profile table 7 : 32 bit rimm module current profile i dd total 32 bit rimm module capacity 32 bit rimm module power conditions a a. actual power will depend on memory controller and usage patterns. power does not include refresh current. 512mb 256mb 128mb unit max max max i dd1 one rdram device per channel in read b , balance in nap mode b. i/o current is a function of the % of 1?s, to add i/o power for 50% 1?s for a x16 need to add 257ma or 290ma for x18 ecc mod ule for the follow- ing: v dd = 2.5v, v term = 1.8v, v ref = 1.4v and v dil = v ref - 0.5v. rimm 4800 1616 1584 1568 ma rimm 4200 1456 1424 1408 rimm 3200 1176 1144 1128 i dd2 one rdram device per channel in read b , balance in standby mode rimm 4800 3170 2250 1790 ma rimm 4200 2870 2030 1610 rimm 3200 2450 1690 1310 i dd3 one rdram device per channel in read b , balance in active mode rimm 4800 3940 2580 1900 ma rimm 4200 3640 2360 1720 rimm 3200 3010 1930 1390 i dd4 one rdram device per channel in write, balance in nap mode rimm 4800 1606 1574 1558 ma rimm 4200 1436 1404 1388 rimm 3200 1146 1114 1098 i dd5 one rdram device per channel in write, balance in standby mode rimm 4800 3160 2240 1780 ma rimm 4200 2850 2010 1590 rimm 3200 2420 1660 1280 i dd6 one rdram device per channel in write, balance in active mode rimm 4800 3930 2570 1890 ma rimm 4200 3620 2340 1700 rimm 3200 2980 1900 1360
page 10 version 1.0 jan. 2004 md16r1624(8/g)eg0 ac electrical specifications table 8 : ac electrical specifications symbol parameter and conditions: a 128mb, 256mb, 512mb modules a. specifications apply per channel min typ max unit z l module impedance of rsl signals 25.2 28.0 30.8 ? z ul-cmos module impedance of sck and cmd signals 23.8 28.0 32.2 ? t pd propagation delay variation of rsl signals. average clock delay from finger to finger of all rsl clock nets (ctm, ctmn, cfm, and cfmn) see table10 b b. t pd or average clock delay is defined as the delay from finger to finger of rsl signal. ps ? t pd propagation delay variation of rsl signals with respect to t pd a,c c. if the module meets the following specification, it is compliant to the specification. if the module does not meet these spe cifications, the specifica- tion can be adjusted by the ?adjusted ? t pd specification? table 9 below. adjusted ? t pd specification -21 21 ps ? t pd-cmos propagation delay variation of sck sign al with respect to an average clock delay a -250 250 ps ? t pd-sck,cmd propagation delay variation of cmd signal with respect to sck signal -200 200 ps v /v in attenuation limit 17.0 % v xf /v in forward crosstalk coefficient (300ps input rise time @ 20%-80%) 4.0 % v xb /v in backward crosstalk coefficient (3 00ps input rise time @ 20%-80%) 2.0 % r dc dc resistance limit - - 0.8 ? table 9 : adjusted ? t pd specification symbol parameter and conditions adjusted min/max absolute min / max unit ? t pd propagation delay variation of rsl signals with respect to t pd for 4, 8 and 16 device modules +/- [17+(18*(n/ 2) * ? z0)] a a. where: n = number of rdram devices installed on the rimm module ? z0 = delta z0% = (max z0 - min z0)/(min z0) (max z0 and min z0 are obtained from the loaded (high im pedance) impedance coupons of all rsl layers on the modules) -30 30 ps
page 11 version 1.0 jan. 2004 md16r1624(8/g)eg0 32 bit rimm module t pd specification table 10 : 32 bit rimm module t pd specification i dd 32 bit rimm module capacity 512mb 256mb 128mb unit parameter and condition for rimm 4800, rimm 4200, rimm 3200 max max max t pd propagation delay per channel, all rsl signals 1.36 1.02 0.89 ns
page 12 version 1.0 jan. 2004 md16r1624(8/g)eg0 figure 3 : 32 bit rimm modu le pcb physical dimensions physical dimensions -1 ( for pcb ) the following defines the 2 channel rdram module dimensions. all units are in millimeters with in ches in brackets[ ], where ap propriate. the dimensions without tolerance specif ication use the default tolerance of 0.127[ 0.005]. 0.80 0.10 0.15 0.10 2.99 0.05 [0.031 0.004] [0.006 0.004] [0.12 0.002] detail a 3.00 0.10 3.00 0.10 detail b [0.118 0.004] [0.118 0.004] min.4.88 [0.192] 1.00[0.039] heat spreader 133.35 0.127[5.250 0.005] 1.00[0.039] 5.68[0.2236] 34.93[1.375] a-1 a-116 2.85[0.112] 2.85[0.112] r 2.00 component area (a side) dia 2.44 127.65[5.026] 4.00 0.15 [0.157 0.006] 32.08[1.26] 17.78[0.700] b-1 r 2.00 dia 2.44 b-116 8.60[0.339] note : the gray area above represents th e contact surface of the heat spreader. component area (b side) 7.468[0.294]
page 13 version 1.0 jan. 2004 md16r1624(8/g)eg0 physical dimensions -2 ( for heat spreader ) the following defines the 2 channel rdram module dimensions. all units are in millimeters with in ches in brackets[ ], where ap propriate. the dimensions without tolerance specif ication use the default tolerance of 0.127[ 0.005]. figure 4: heat spreader physical dimensions 133.35 0.127[5.250 0.005] 29.42[1.158] 34.93[1.375] a a 2.9 1.00 0.07 [0.04 0.002] [0.114] material csp 1.27 0.10 [0.050 0.004] thermal conductive gap filling max 7.80 [0.307] pcb heat spreader [ double side module ] section a-a material csp 1.27 0.10 [0.050 0.004] thermal conductive gap filling max 4.70 [0.185] pcb heat spreader [ single side module ] section a-a 112.7 0.12[4.436 0.005] 132.76 0.25[5.226 0.009] 127.66 0.12[5.023 0.005] 12.7 0.07[0.5 0.002] 12.7 0.07[0.5 0.002] 29.42[1.158] warning ! hot surface http://www.samsungsemi.com warning ! hot surface http://www.samsungsemi.com center-point dia 2.36 0.05[0.09 0.001]
page 14 version 1.0 jan. 2004 md16r1624(8/g)eg0 32 bit rimm module marking the 32 bit rimm modules av ailable from samsung are marked like figure 5 below. th is marking also assists users to specify and verify if the correct 32 bit rimm modules are installed in their systems. in the diagram, a label is shown attached to the 32 bit rimm module ? s heat spreader. information contained on the la bel is specific to the 32 bit rimm module and provides rd ram device information without requiring removal of the 32 bit rimm module?s heat spreader. a b c d e f g j h k i md16r162geg0-cn1 rimm 4800 102 korea 0410 512mb /16 label field description marked text unit a vendor logo 32 bit rimm module vendor samsung logo area samsung - b country country of origin korea - c year & week code manufactured year & week code yyww - d module memory capacity number of 8-bit or 9-bit mbytes of rdram storage in 32 bit rimm module 128mb, 256mb, 512mb - e number of rdram devices number of rdram devices co ntained in the 32 bit rimm module 4/8/16 rdram devices f ecc support indicates whether the 32 bit rimm module supports 8 (non ecc) or 9 (ecc) bit bytes blank = 8 bit bytes ecc = 9 bit bytes - g notice! hot surface caution notice. - - h caution logo iso standard - - i gerber & spd ve r s i o n pcb gerber file & spd code version used on 32 bit rimm module gerber : 10 = 1.0 ver. spd : 2 = 1.3 ver. - j product name product name rimm 4800, rimm 4200, rimm 3200 - k part no. samsung 32 bit rimm module part no. see table 1 - figure 5 : 32 bit rimm module marking example
page 15 version 1.0 jan. 2004 md16r1624(8/g)eg0 table of contents overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 key timing parameters/part numbers . . . . . . . . . . . . . . . . 1 module pad numbers and signal names . . . . . . . . . . . 2 - 3 module connector pad description . . . . . . . . . . . . . . . 3 - 6 32 bit rimm module func tional diagram . . . . . . . . . . . . 7 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . 8 dc recommended electrical conditions . . . . . . . . . . . . . . 8 32 bit rimm module supply current profile . . . . . . . . . . 9 ac electrical specifications . . . . . . . . . . . . . . . . . . . 10 - 11 physical dimensions -1 ( for pcb ) . . . . . . . . . . . . . . . . . 12 physical dimensions -2 ( for heat spreader) . . . . . . . . . . 13 standard 32 bit rimm module marking . . . . . . . . . . . . . 14 copyright ? jan. 2004, samsung electronics. all rights reserved. direct rambus, direct rdram and so-rimm are trade- marks of rambus inc. ra mbus, rdram, rimm and the rambus logo are registered tr ademarks of rambus inc. this document contains advanced information that is subject to change by samsung electronics without notice document version 1.0 samsung electronics co. ltd. san #16 banwol-ri, taean-eup hwasung-city, gyeonggi-do, korea telephone: 82-31-208-6369 fax: 82-31-208-6799 http://www.intl.samsungsemi.com

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